doi:10.16597/j.cnki.issn.1002-154x.2026.02.009
晶圆清洗技术及数值模拟研究进展
姚炳旭1,2 宋润锴1,2 周建成1,2 焦真1,2*
（1.bet体育365官网网站，南京211189；2.bet体育365官网网站-蒙纳士大学联合研究生院，苏州215123）
摘 要 硅晶圆表面洁净度是先进半导体制造的核心要素之一，高效去除其表面颗粒对保障材料性能与产品良率极为重要。数值模拟结合实验已成为揭示去除机制、优化工艺的关键工具。作者综述了近年清洗技术创新与数值模拟进展，分析了各种因素对清洗效果的影响。同时，探讨了现有技术与模拟方法的优缺点，并展望了未来颗粒去除技术和数值模拟应用方向。
关键词 晶圆清洗 颗粒去除 计算流体力学 二流体喷嘴
Research Progress of Wafer Cleaning Technology and Numerical Simulation
YAO Bingxu1,2,SONG Runkai1,2,ZHOU Jiancheng1,2,JIAO Zhen1,2*
(1.School of Chemistry and Chemical Engineering,Southeast University,Nanjing 211189,China;2.Southeast University-Monash Joint Graduate School,Suzhou 215123,China)
Abstract The cleanliness of the wafer surface is one of the core factors in advanced semiconductor manufacturing. Efficient removal of surface particles is crucial for ensuring material performance and product yield. Numerical simulation combined with experiments has become a key tool for revealing the removal mechanisms and optimizing processes. This paper reviews the recent innovations in cleaning technologies and the progress in numerical simulation,analyzing the impact of various factors on cleaning effectiveness. Additionally,this paper discusses the advantages and disadvantages of existing technologies and simulation methods,and looks forward to the future application directions of particle removal technologies and numerical simulation.
Keywords wafer cleaning particle removal computational fluid dynamics two-fluid nozzle